Shenzhen SMTfly Electronic Equipment Manufactory Ltd
Shenzhen SMTfly Electronic Equipment Manufactory Ltd
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29*29mm FOV SPI - 3D Solder Paste Inspection | Machines for SMT Line,SMTfly-V700 Features:
Red glue detection
This device, in addition to supporting common 3D solder paste inspection, can also detect red rubber process at the same time, supporting missed printing, overflowing plastics, multiple adhesives, and low adhesives, etc., and displaying full-color defective image. Positioning.
Bare-board learning programming
No Gerber and CAD files are required, as long as a bare board is provided, automatic learning programming can be realized. The software automatically extracts the detection frame data, and the user edits it appropriately, and sets detection parameters and allowable values.
Automatic plate bend compensation
The three-dimensional plate bending compensation technique is used to perform surface fitting on the discrete reference points in the FOV to perform real-time compensation during the detection process. There is no need to move the Z axis and the detection speed is faster.
SPI - 3D Solder Paste Inspection | Machines for SMT Line,SMTfly-V700 Specification:
| Category | Item | Specifications | ||
|
Inspection System |
Camera | Full digital high speed CCD camera, 5 million pixels | ||
| Light source | Ring LED light source | |||
| FOV | 29mm*29mm(18μm) | |||
| Processing time per picture | <0.6s | |||
| Test content | Paste printing / red plastic printing: volume, area, height, shape, offset, continuous tin, overflow glue | |||
| Defect Types | Yes, Offset, Multi-Tin, Less Tin, Continuous Tin, Tip, Collapse, Alien, Gold finger, Insufficient Height, Height Exceeded, Overfill, Insufficient, etc. | |||
| Paste height range | 30~400um | |||
| Paste size range | 0.15mm×0.15mm~10mm×10mm | |||
| Height detection accuracy | 1μm (based on actual solder paste and 3D correction block) | |||
| Repeat ability (volume/area/height) | <1μm@3sigma | |||
| Repeat ability & Reproduce ability | <10% | |||
|
Software System |
Operating System | Windows 7 | ||
|
Identification System |
Features | 3D bidirectional raster projection head (single head optional), no shadow 3D detection | ||
| Operational interface | Graphical programming, easy operation, switchable English, traditional and simplified systems | |||
| Interface display | 2D/3D color map | |||
| MARK | can select 2 common Mark points, multi-Mark function can be selected in the puzzle, and Bad Mark function is supported | |||
| Programming | Support Gerber, CAD import, support offline programming and manual programming | |||
| SPC | Offline SPC | Support | ||
| SPC Report | Anytime Report | |||
| Histogram/control chart | Volume,area, height, offset | |||
| Exportable Content |
Reports (Excel), Pictures (jpg, bmp)
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| Mechanical System | PCB Transfer System | Substrate fixing method: bottom-up fixing; automatic access plate and automatic width adjustment system, conforming to SMEMA standard; track height: 900±20mm | ||
| PCB size | 25mm*60mm~250mm*300mm (Customized) | |||
| PCB thickness | 0.3mm~3mm | |||
| Plate bending compensation | <1mm | |||
| X, Y Platform | Drive Equipment |
AC Servo Motor System |
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| Positioning accuracy | <1μm | |||
| Travel speed | 700mm/s | |||
| Control System | Computer Host | Industrial Control Computer: Intel High-end quad-core CPU, 8GDDR memory, 1T hard disk | ||
| Display output | 19-inch widescreen LCD monitor | |||
| Other parameters | Mechanical dimensions (length * width * height) | 82cm*65cm*76cm | ||
| Weight | 75 kg | |||
| Power | AC220V±10%, 50/60Hz, 450W | |||
| Air source | 4-6bar | |||
| Working environment Temperature | 10-40°C, Humidity 30-80%RH | |||