Heat Pulse PCB Hot Bar Soldering Machine for FPC HSC FFC to PCB,SMTfly-PP1S Features:
- Closed Loop PID temperature control with visible LED display;
- LCD display programmable pressure switch for precise force control;
- Each heating cycle is triggered by a real time pressure sensor;
- Floating thermode ensures consistent pressure and heat transfer
- between the thermode head and the parts to be joined;
- Silicon rubber can be fitted in bonding Heat Seal Connectors
- between LCD and PCB;
- Standard workpiece holder is mounted on a linear guideway and
- designed to allow for easy changeover and repeatable operation;
- Parts registration is adjusted by micrometer and secured by vacuum
- Lock;
- Optional CCD system for fine pitch component.
Heat Pulse PCB Hot Bar Soldering Machine for FPC HSC FFC to PCB Specification:
| Size | 500mm X 750mm X 910mm |
| Work Air Pressure | 0.5-0.7MPA |
| Working Area | 110mm X 150mm |
| Temperature setup | 0-400℃ |
| Tolerance of Temp | +2° |
| Time of pressing | 0-99s |
| Tolerance of Pressing | 0.05MPA |
Heat Pulse PCB Hot Bar Soldering Machine for FPC HSC FFC to PCB Application:
Apply to the hot-pressing/welding/soldering for high density HSC to LCD or PCB etc
use constant temperature to hot pressing
1. mainly apply to the hot-pressing/welding/soldering for high density HSC to LCD or PCB etc,
2. use constant temperature to hot pressing.
Sample for Hotbar Bonding Machine:
